Nitride semiconductor device and method for manufacturing the same

ABSTRACT

A nitride semiconductor device includes: an electron transit layer including GaxIn1-xN (0&lt;x≤1); an electron supply layer formed on the electron transit layer and including AlyIn1-yN (0&lt;y≤1); a gate insulating film formed to pass through the electron supply layer to contact the electron transit layer; and a gate electrode facing the electron transit layer with the gate insulating film interposed therebetween, wherein, in the electron transit layer, a portion contacting the gate insulating film and a portion contacting the electron transit layer are flush with each other.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. application Ser. No.15/286,653, filed on Oct. 6, 2016, and allowed on Nov. 20, 2017, whichis based upon and claims the benefit of priority from Japanese PatentApplication No. 2015-200415, filed on Oct. 8, 2015, the entire contentsof which are incorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates to a nitride semiconductor device and amethod for manufacturing the same.

BACKGROUND

In the related art, a transistor is known which includes a buffer layerincluding GaN, a barrier layer including AlGaN formed on the bufferlayer, a gate insulating film disposed in a trench formed in the barrierlayer, and a gate electrode facing the buffer layer with the gateinsulating film interposed therebetween.

In the transistor known in the related art, the trench is formed topenetrate through an electron supply layer in order to prevent 2DEG (TwoDimensional Electron Gas) from being formed immediately under the gateelectrode when the gate electrode is turned off. No 2DEG is formed in aportion in which the trench is formed since there is no boundary betweenthe electron supply layer and an electron transit layer. Thus, anormally-off operation is realized.

However, in the transistor known in the related art, the trench isformed to dig down a portion of the electron transit layer through theelectron supply layer, and a portion of a region where 2DEG is to beformed when the gate electrode is turned on is lost. Therefore, an erroroccurs in a control voltage required to form the 2DEG which may resultin occurrence of a switching noise or increase in undesirable energyloss.

SUMMARY

The present disclosure provides some embodiments of a nitridesemiconductor device which is capable of realizing a stable normally-offoperation while preventing an electron transit layer from being damaged.

According to one embodiment of the present disclosure, there is provideda nitride semiconductor device including: an electron transit layerincluding Ga_(x)In_(1-x)N (0<x≤1); an electron supply layer formed onthe electron transit layer and including Al_(y)In_(1-y)N (0<y≤1); a gateinsulating film formed passing through the electron supply layer tocontact the electron transit layer; and a gate electrode facing theelectron transit layer with the gate insulating film interposedtherebetween. In the electron transit layer, a portion contacting thegate insulating film and a portion contacting the electron transit layerare flush with each other.

With this configuration, in the electron transit layer, since a portioncontacting the gate insulating film and a portion contacting theelectron transit layer are flush with each other, it is possible toprovide a nitride semiconductor device capable of realizing a goodnormally-off operation. The nitride semiconductor device having suchcharacteristics is manufactured by a method including the followingsteps. A method for manufacturing a nitride semiconductor device,includes: forming an electron supply layer including Al_(y)In_(1-y)N(0<y≤1) on an electron transit layer including Ga_(x)In_(1-x)N (0<x≤1);and forming an oxide in a portion of the electron supply layer byselectively oxidizing the electron supply layer by a plasma oxidationmethod. The act of forming an oxide includes forming the electrontransit layer such that a portion of the electron transit layercontacting the oxide and a portion of the electron transit layercontacting the electron supply layer are flush with each other.

With the above method, an oxide is formed in a portion of the electronsupply layer by selectively oxidizing the electron supply layer by aplasma oxidation method. According to the plasma oxidation method, whenthe oxide is formed in the portion of the electron supply layer, sinceno or little oxygen in the atmosphere enters the electron transit layer,it is possible to form the oxide in the electron supply layer whileavoiding oxidation of the electron transit layer. Thus, it is possibleto form the electron transit layer in which a portion contacting theoxide and a portion contacting the electron supply layer are flush witheach other while effectively preventing the electron transit layer frombeing damaged. As a result, it is possible to provide a nitridesemiconductor device capable of realizing a good normally-off operation,and a method for manufacturing the same.

The method may further include, after the act of forming an oxide,removing the oxide by etching, and then forming a trench to expose theelectron transit layer in the electron supply layer; forming a gateinsulating film in the trench; and forming a gate electrode facing theelectron transit layer with the gate insulating film interposedtherebetween. With this method, since the oxide formed in the electronsupply layer has the etching selectivity to the electron transit layer,it is possible to remove the oxide while preventing the electron transitlayer from being etched. Thus, since it is possible to form the electrontransit layer in which a portion contacting the gate insulating film anda portion contacting the electron supply layer are flush with eachother, a good normally-off operation can be achieved.

The act of forming an oxide may also form a gate insulating film, andthe method may further include, after the act of forming an oxide,forming a gate electrode facing the electron transit layer with theoxide interposed therebetween. With this method, the oxide can be, as itis, used as a portion of the gate insulating film. Thus, it is possibleto form the electron transit layer in which a portion contacting theoxide as the portion of the gate insulating film and a portioncontacting the electron supply layer are flush with each other.

The nitride semiconductor device may further include a trench formed inthe electron supply layer to expose the electron transit layer. In thiscase, the gate insulating film may be formed in the trench. The nitridesemiconductor device may further include a nonconductive spacer layerformed on the electron supply layer. In this case, the trench may beformed to expose the electron transit layer through the spacer layer andthe electron supply layer.

In this configuration, the gate insulating film may be formed along theinner wall of the trench and the surface of the electron transit layer.In addition, in the gate insulating film, a portion formed along theinner wall of the trench may be thicker than a portion formed along thesurface of the electron transit layer. With this configuration, it ispossible to reduce electric capacity between the inner wall of thetrench and the gate electrode. As a result, it is possible to suppressoccurrence of a switching noise, thereby improving the switchingcharacteristics.

In the nitride semiconductor device, the gate insulating film mayinclude an oxide of the electron supply layer. The gate insulating filmmay include one or more insulating materials selected from a groupconsisting of SiO₂, Al₂O₃, AlON and SiN. The gate insulating film may beformed to have a thickness that causes an electric field in the gateinsulating film to be equal to or less than 10 MV/cm.

According to another embodiment of the present disclosure, there isprovided a nitride semiconductor device comprising: an electron transitlayer; a first electron supply layer and a second electron supply layerwhich are sequentially formed on the electron transit layer in the orderas they are written; a gate insulating film formed to be buried in thesecond electron supply layer such that the gate insulating film facesthe first electron supply layer; and a gate electrode facing theelectron transit layer with the gate insulating film and the firstelectron supply layer interposed therebetween. In this configuration, aconduction band energy level at an interface between the first electronsupply layer immediately under the gate electrode and the electrontransit layer may be larger than a Fermi energy level, and a conductionband energy level at an interface between the first electron supplylayer, which does not lie immediately under the gate electrode, and theelectron transit layer may be smaller than the Fermi energy level.

With this configuration, it is possible to provide a nitridesemiconductor device capable of realizing a good normally-off operation.The nitride semiconductor device having such characteristics ismanufactured by a method including the following steps. A method formanufacturing a nitride semiconductor device, includes: forming a firstelectron supply layer on an electron transit layer such that aconduction band energy level at an interface between the first electronsupply layer and the electron transit layer becomes larger than a Fermienergy level; forming a second electron supply layer on the firstelectron supply layer such that a conduction band energy level at aninterface between the electron transit layer and the first electronsupply layer becomes smaller than the Fermi energy level; and forming anoxide on a portion of the second electron supply layer by selectivelyoxidizing the second electron supply layer, and causing the conductionband energy level at the interface between the first electron supplylayer immediately under the oxide and the electron transit layer to belarger than the Fermi energy level.

With this method, since the electron transit layer is not exposed to theair after the first electron supply layer is formed, it is possible toeffectively prevent the electron transit layer from being damaged due tooxidation or etching. Thus, it is possible to provide a nitridesemiconductor device capable of realizing a stable normally-offoperation, and a method for manufacturing the same. The method mayfurther include, after the act of forming an oxide, removing the oxideby etching to form a trench having a bottom facing the first electronsupply layer in the second electron supply layer; forming a gateinsulating film in the trench; and forming a gate electrode facing theelectron transit layer with the gate insulating film and the firstelectron supply layer interposed therebetween.

In the method, the act of forming an oxide may also form a gateinsulating film. In this case, the method may further include, after theact of forming an oxide, forming a gate electrode facing the electrontransit layer with the gate insulating film and the first electronsupply layer interposed therebetween. In the nitride semiconductordevice, the electron transit layer may include a nitride semiconductor,the first electron supply layer may include a nitride semiconductorhaving a lattice constant smaller than a lattice constant of theelectron transit layer, and the second electron supply layer may includea nitride semiconductor having a lattice constant smaller than thelattice constant of the first electron supply layer.

In the nitride semiconductor device, the electron transit layer mayinclude Ga_(x)In_(1-x)N (0<x≤1), the first electron supply layer mayinclude Al_(a)Ga_(b)In_(c)N (0≤a≤1, 0≤b≤1, 0≤c≤1 and a+b+c=1), and thesecond electron supply layer may include Al_(y)In_(1-y)N (0<y≤1). In thenitride semiconductor device, the first electron supply layer may have astacked structure including a plurality of stacked nitride semiconductorlayers made of Al_(a)Ga_(b)In_(c)N (0≤a≤1, 0≤b≤1, 0≤c≤1 and a+b+c=1).

The nitride semiconductor device may further include a trench formed inthe second electron supply layer. In this configuration, the gateinsulating film may be formed in the trench. In the nitridesemiconductor device, the gate insulating film may include an oxide ofthe second electron supply layer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view showing a nitride semiconductor deviceaccording to a first reference example.

FIG. 2A is a sectional view showing a step in a process of manufacturingthe nitride semiconductor device shown in FIG. 1.

FIG. 2B is a sectional view showing a step subsequent to the step shownin FIG. 2A.

FIG. 3 is a sectional view showing a nitride semiconductor deviceaccording to a second reference example.

FIG. 4 is a sectional view showing a nitride semiconductor deviceaccording to a third reference example.

FIG. 5 is a sectional view showing a step in a process of manufacturingthe nitride semiconductor device shown in FIG. 4.

FIG. 6 is a sectional view showing a nitride semiconductor deviceaccording to a first embodiment of the present disclosure.

FIG. 7 is a TEM image showing a portion of the nitride semiconductordevice shown in FIG. 6.

FIG. 8A is a sectional view showing a step in a process of manufacturingthe nitride semiconductor device shown in FIG. 6.

FIG. 8B is a sectional view showing a step subsequent to the step shownin FIG. 8A.

FIG. 8C is a sectional view showing a step subsequent to the step shownin FIG. 8B.

FIG. 8D is a sectional view showing a step subsequent to the step shownin FIG. 8C.

FIG. 8E is a sectional view showing a step subsequent to the step shownin FIG. 8D.

FIG. 9 is a sectional view showing a nitride semiconductor deviceaccording to a second embodiment of the present disclosure.

FIG. 10 is a sectional view showing a nitride semiconductor deviceaccording to a third embodiment of the present disclosure.

FIG. 11 is a sectional view showing a nitride semiconductor deviceaccording to a fourth embodiment of the present disclosure.

FIG. 12A is a sectional view showing a step in a process ofmanufacturing the nitride semiconductor device shown in FIG. 11.

FIG. 12B is a sectional view showing a step subsequent to the step shownin FIG. 12A.

FIG. 12C is a sectional view showing a step subsequent to the step shownin FIG. 12B.

FIG. 12D is a sectional view showing a step subsequent to the step shownin FIG. 12C.

FIG. 12E is a sectional view showing a step subsequent to the step shownin FIG. 12D.

FIG. 12F is a sectional view showing a step subsequent to the step shownin FIG. 12E.

FIG. 13 is a sectional view showing a nitride semiconductor deviceaccording to a fifth embodiment of the present disclosure.

FIG. 14 is a sectional view showing a nitride semiconductor deviceaccording to a sixth embodiment of the present disclosure.

FIG. 15 is a sectional view showing a portion of a nitride semiconductordevice according to one modification.

FIG. 16 is a sectional view showing a portion of a nitride semiconductordevice according to another modification.

FIG. 17 is a sectional view showing a modification of the nitridesemiconductor device shown in FIG. 6.

FIG. 18 is a sectional view showing a modification of the nitridesemiconductor device shown in FIG. 11.

DETAILED DESCRIPTION

Some reference examples and exemplary embodiments of the presentdisclosure will now be described in detail with reference to theaccompanying drawings. Prior to description on the exemplary embodimentsof the present disclosure, some reference examples will be describedbelow.

First Reference Example

FIG. 1 is a sectional view showing a nitride semiconductor device 101according to a first reference example. A nitride semiconductor device101 is a high electron mobility transistor (HEMT) using a Group-IIInitride semiconductor. The nitride semiconductor device 101 includes asubstrate 102 on which a buffer layer 103, an electron transit layer104, an electron supply layer 105, a passivation film 106, and anonconductive spacer layer 107 are sequentially stacked in the order asthey are written.

Both of the electron transit layer 104 and the electron supply layer 105are made of Al_(x)Ga_(y)In_(z)N (0≤x≤1, 0≤y≤1, 0≤z≤1 and x+y+z=1). Inthis example, the electron transit layer 104 is made of GaN and theelectron supply layer 105 is made of AlGaN. The electron transit layer104 and the electron supply layer 10 contain Ga and N in common. 2DEG(Two Dimensional Electron Gas) is formed in the vicinity of an interfacein the electron transit layer 104 between the electron transit layer 104and the electron supply layer 105 (e.g., at a distance of several Å orso from the interface). The passivation film 106 is made of, e.g., SiNand the spacer layer 107 is made of, e.g., SiO₂.

A trench 108 to expose the electron transit layer 104 is formed in theelectron supply layer 105. More specifically, the trench 108 is formedto dig down a surface portion of the electron transit layer 104 throughthe spacer layer 107, the passivation film 106 and the electron supplylayer 105. A gate insulating film 109 is formed to extend along theinner wall of the trench 108. A concave space defined by the gateinsulating film 109 is filled with a gate electrode 110.

In addition, a source electrode 111 and a drain electrode 112 are formedwith a space from the gate electrode 110. Both of the source electrode111 and the drain electrode 112 are electrically connected to theelectron supply layer 105 through the gate insulating film 109, thespacer layer 107 and the passivation film 106. FIGS. 2A and 2B aresectional views showing steps in a process of manufacturing the nitridesemiconductor device 101 shown in FIG. 1.

In order to manufacture the nitride semiconductor device 101, the bufferlayer 103, the electron transit layer 104, the electron supply layer105, the passivation film 106 and the nonconductive spacer layer 107 aresequentially stacked on the substrate 102 in the order as they arewritten by means of, e.g., a CVD method or the like, as shown in FIG.2A. Next, a mask 113 having an opening 114 selectively in a region inwhich the trench 108 is to be formed is formed on the spacer layer 107.Next, the spacer layer 107 and the passivation film 106 are partiallyremoved by means of dry etching or wet etching using the mask 113 as amask.

Next, as shown in FIG. 2B, an unnecessary portion of the electron supplylayer 105 is removed by means of dry etching or wet etching. Thus, thetrench 108 is formed. In this step, since etching selectivity of theelectron transit layer 104 and the electron supply layer 105 is small, asurface portion of the electron transit layer 104 is etched(over-etched) along with the electron supply layer 105. Thereafter, thegate insulating film 109, the gate electrode 110, the drain electrode112 and the source electrode 111 are formed. Thus, the nitridesemiconductor device 101 is manufactured.

In the nitride semiconductor device 101, the trench 108 is formed topenetrate through the electron supply layer 105 in order to prevent 2DEF from being formed immediately under the gate electrode 110 when thegate electrode 110 is turned off. No 2DEG is formed in a portion inwhich the trench 108 is formed since there is no boundary between theelectron supply layer 105 and the electron transit layer 104. Thus, anormally-off operation is realized.

However, the trench 108 is formed to dig down a portion of the electrontransit layer 104 through the electron supply layer 105, and a portionof a region where 2DEG is to be formed when the gate electrode 110 isturned on is lost. Therefore, an error occurs in a control voltagerequired to form the 2DEG, which may result in an occurrence of aswitching noise or increase in an undesirable energy loss.

Since etching selectivity of the electron transit layer 104 (GaN) andthe electron supply layer 105 (AlGaN) is small, such as a trench 108 isformed as the electron transit layer 104 is etched (over-etched) alongwith the electron supply layer 105. Therefore, by shortening an etchingtime for the electron supply layer 105, it is considered that it ispossible to prevent the electron transit layer 104 from being damaged. Astructure for achieving this configuration is shown, as a nitridesemiconductor device 115 according to a second reference example, inFIG. 3.

Second Reference Example

FIG. 3 is a sectional view showing a nitride semiconductor device 115according to a second reference example.

The nitride semiconductor device 115 is different from theabove-described nitride semiconductor device 101 in that a portion ofthe electron supply layer 105 is interposed between the gate electrode110 and the electron transit layer 104. However, the nitridesemiconductor device 115 has the same configuration in other aspects asthe above-described nitride semiconductor device 101 and therefore, anexplanation of which will not be repeated. In the electron transit layer104 (GaN) and the electron supply layer 105 (AlGaN) having relativelysmall etching selectivity, since it is very difficult to control anetching degree of the electron supply layer 105, the electron supplylayer 105 cannot help partially remaining in order to avoid over-etchingthe electron transit layer 104. This results in an unstable normally-offoperation due to the partial interposition of the electron supply layer105 between the gate electrode 110 and the electron transit layer 104,as shown in FIG. 3. As a third reference example, a nitridesemiconductor device 116 manufactured by a manufacturing methoddifferent from those of the nitride semiconductor devices 101 and 115according the first and second reference examples is shown in FIG. 4.

Third Reference Example

FIG. 4 is a sectional view showing a nitride semiconductor device 116according to a third reference example.

In the nitride semiconductor device 116, the gate insulating film 109made of an oxide of the electron supply layer 105 is formed in thebottom of the trench 108. The oxide of the electron supply layer 105includes Ga₂O₃, Al₂O₃ or AlON. In addition, as a portion of the gateinsulating film 109, an insulating film 117 made of an oxide of theelectron transit layer 104 is formed in a portion in the surface of theelectron transit layer 104 which contacts the gate insulating film 109.The oxide of the electron transit layer 104 includes Ga₂O₃. Otherconfigurations are the same as the above-described nitride semiconductordevice 101 and, therefore, explanation of which will not be repeated.

FIG. 5 is a sectional view showing a step in a process of manufacturingthe nitride semiconductor device 116 shown in FIG. 4. In a method formanufacturing the nitride semiconductor device 116, after the spacerlayer 107 and the passivation film 106 are removed, the electron supplylayer 105 is subjected to thermal oxidation treatment at a temperatureof, e.g., 1000 degrees C. or more, a portion of the electron supplylayer 105 is oxidized by the thermal oxidation treatment, therebyforming an oxide of the electron supply layer 105.

Thus, the gate insulating film 109 made of the oxide of the electronsupply layer 105 is formed in the bottom of the trench 108. Further, inthe thermal oxidation treatment, since the amount of heat applied toeach layer is relatively large, damage occurs in a crystal structure ofeach layer and oxidation proceeds in the successive electron transitlayer 104 when the electron supply layer 105 begins to be oxidized. As aresult, the surface portion of the electron transit layer 104 isoxidized to form the insulating film 117 made of the oxide of theelectron transit layer 104.

In this manner, in the nitride semiconductor device 116 of the thirdreference example, the insulating film 117 made of the oxide of theelectron transit layer 104 is formed in a region where 2DEG is to beformed, by the thermal oxidation treatment, which results in damage tothe 2DEG. Therefore, there arises the same kind of problem as thenitride semiconductor device 101 of the first reference example. For thepurpose of solving the problems of the nitride semiconductor devices101, 115 and 116 according to the first to third reference examples, thepresent inventors suggest configurations of first to sixth embodimentsdescribed below.

First Embodiment

FIG. 6 is a sectional view showing a nitride semiconductor device 1according to a first embodiment of the present disclosure. FIG. 7 is aTEM (Transmission Electron Microscope) image showing a portion of thenitride semiconductor device 1 shown in FIG. 6.

The nitride semiconductor device 1 is an HEMT using a Group-III nitridesemiconductor. The nitride semiconductor device 1 includes a substrate2. An example of the substrate 2 may include a Si substrate, SiCsubstrate, sapphire substrate, GaN substrate or the example. On thesubstrate 2 are stacked a buffer layer 3, an electron transit layer 4,an electron supply layer 5, a passivation film 6 and a nonconductivespacer layer 7 in the order as thy are written. The buffer layer 3 isformed to be coherent to the surface of the substrate 2. The bufferlayer 3 may have a stacked structure including a plurality of stackedGroup-III nitride semiconductor layers. In this embodiment, the bufferlayer 3 includes a first buffer layer 8 formed on the substrate 2, and asecond buffer layer 9 stacked on the first buffer layer 8. The firstbuffer layer 8 includes an AlN film and has a thickness of, e.g., about0.2 μm. The second buffer layer 9 includes an AlGaN film and has athickness of, e.g., about 0.2 μm.

The electron transit layer 4 is formed to be coherent to the bufferlayer 3. The electron transit layer 4 includes Ga_(x)In_(1-x)N (0<x≤1).In this embodiment, the electron transit layer 4 is made of GaN. Thethickness of the electron transit layer 4 is, e.g., equal to or lessthan 0.1 μm and equal to or more than 10 μm. The electron supply layer 5is formed to be coherent to the electron transit layer 4. The electronsupply layer 5 includes Al_(y)In_(1-y)N (0<y≤1). In this embodiment, theelectron supply layer 5 is made of AlN. The thickness of the electronsupply layer 5 is, e.g., equal to or less than 1 Å and equal to or morethan 100 Å. 2DEG is formed in the vicinity of an interface in theelectron transit layer 4 between the electron transit layer 4 and theelectron supply layer 5 (e.g., at a distance of several Å or so from theinterface).

The passivation film 6 is formed of an insulating film such as, e.g., aSiN or the like and has a thickness of, e.g., equal to or less than 10 Åand equal to or more than 1000 Å. The spacer layer 7 is formed of aninsulating film such as, e.g., a SiO₂ or the like and has a thicknessof, e.g., equal to or less than 1 μm and equal to or more than 10 μm. Agate insulating film 10 contacting the electron transit layer 4 isformed to penetrate through the electron supply layer 5. Morespecifically, in this embodiment, a trench 11 penetrating through thespacer layer 7, the passivation film 6 and the electron supply layer 5is formed to expose the electron transit layer 4 and the gate insulatingfilm 10 is formed in the trench 11. The trench is filled with a gateelectrode 12 via the gate insulating film 10.

The gate insulating film 10 has a first portion 10 a formed along theinner wall of the trench 11 and a second portion 10 b formed along thesurface of the electron transit layer 4. In some embodiments, athickness T1 of the first portion 10 a in a direction perpendicular tothe depth direction of the trench 11 is larger than a thickness T2 ofthe second portion 10 b in the depth direction of the trench 11. Thus,it is possible to prevent a switching noise from occurring due to areduction of electric capacity between the inner wall of the trench 11and the gate electrode 12, thereby improving the switchingcharacteristics.

In addition, as shown in FIG. 7, the gate insulating film 10 is formedto have a thickness larger than the total thickness of the electronsupply layer 5 and the passivation film 6. In some embodiments, the gateinsulating film 10 is formed to have a thickness that causes an electricfield E in the gate insulating film to be equal to or less than 10MV/cm. The electric field E is calculated according to an equation ofE=V_(g)/T2 (where, V_(g) is a voltage applied to the gate electrode 12and T2 is thickness of the second portion 10 b). The gate insulatingfilm 10 may be made of one or more insulating materials selected from agroup consisting of SiO₂, Al₂O₃, AlON and SiN. The gate insulating film10 may be a stacked film including a plurality of insulating films madeof an insulating material selected from this group.

A concave space defined by the gate insulating film 10 is filled withthe gate electrode 12. In the trench 11, the gate electrode 12 faces theelectron transit layer 4 with the gate insulating film 10 interposedtherebetween. A portion of the gate electrode 12 is located on thespacer layer 7. The gate electrode 12 may include one or more conductivematerials including Ni, Pt, Mo, W, TiN, Au and Al. A source electrode 13and a drain electrode 14 are formed with a space from the gate electrode12. The source electrode 13 and the drain electrode 14 are both formedin ohmic contact with the electron supply layer 5 through the gateinsulating film 10 on the spacer layer 7, the spacer layer 7 and thepassivation film 6. The source electrode 13 and the drain electrode 14may be made of Ti and/or Al. If the source electrode 13 and the drainelectrode 14 are formed by diffusion of Al, Al of the source electrode13 and the drain electrode 14 may be diffused into the electron supplylayer 5.

As shown in FIG. 7, in the electron transit layer 4, a portioncontacting the gate insulating film 10 and a portion contacting theelectron transit layer 4 are flat with each other, and morespecifically, form one flush surface located in the same plane. In otherwords, in the electron transit layer 4, a portion forming the bottom ofthe trench 11 and a portion other than the bottom of the trench 11 areflat with each other and form one surface. Further, in the nitridesemiconductor device 1 of this embodiment, unlike the nitridesemiconductor device 101 according to the above-described firstreference example, the portion of the electron transit layer 4 formingthe bottom of the trench 11 is not etched (also see FIG. 1). In otherwords, a boundary between a portion of the electron transit layer 4contacting the gate insulating film 10 and a portion contacting theelectron transit layer 4 is formed to be flush with each other without alevel difference in the surface portion of the electron transit layer 4.

In addition, in the nitride semiconductor device 1 of this embodiment,unlike the nitride semiconductor device 116 according to theabove-described third reference example, the insulating film 117 made ofthe oxide (Ga₂O₃) of the electron transit layer 104 is not formed in theportion of the electron transit layer 4 contacting the gate insulatingfilm 10 (also see FIG. 5). In other words, a nitride semiconductor (GaNin this embodiment) of the electron transit layer 4 is exposed from thebottom of the trench 11. Then, the nitride semiconductor of the electrontransit layer 4 faces the gate electrode 12 with the gate insulatingfilm 10 contacting the electron transit layer 4 interposed therebetween.

Next, a method for manufacturing the nitride semiconductor device 1 willbe described with reference to FIGS. 8A to 8E. FIGS. 8A to 8E aresectional views showing steps in a process of manufacturing the nitridesemiconductor device 1 shown in FIG. 6. In order to manufacture thenitride semiconductor device 1, the buffer layer 3, the electron transitlayer 4 (GaN in this embodiment) and the electron supply layer 5 (AlN inthis embodiment) are coherently grown on the substrate 2 in the order asthey are written by means of, e.g., a CVD method or the like, as shownin FIG. 8A.

Next, as shown in FIG. 8B, the passivation film 6 and the spacer layer 7are formed on the electron supply layer 5 in turn by means of, e.g., aCVD method or the like. Next, a mask 16 having an opening 15 selectivelyin a region in which the trench 11 is to be formed is formed on thespacer layer 7. Next, an unnecessary portion of the spacer layer 7 andthe passivation film 6 is partially removed by means of dry etching(e.g., reactive ion etching) using the mask 16 as a mask. Thus, as aportion of the trench 11, an opening 17 is formed. A portion of theelectron supply layer 5 is exposed in the bottom of the electron supplylayer 5. Thereafter, the mask 16 is removed.

Next, as shown in FIG. 8C, the electron supply layer 5 is selectivelyoxidized by means of a plasma oxidation method, thereby forming an oxide18 of the electron supply layer 5 in a portion of the electron supplylayer 5. The oxide 18 includes AlON or Al₂O₃. The plasma oxidationmethod is performed in an oxygen gas atmosphere at a temperature of 100degrees C. to 900 degrees C. for a time of one hour to ten hours. Theoxygen concentration in the atmosphere is, e.g., about 30%. For example,the plasma oxidation method may be performed in an oxygen gas atmosphereat 100 degrees C. for ten hours or in an oxygen gas atmosphere at 900degrees C. for one hour.

According to the plasma oxidation method, when the oxide 18 is formed inthe portion of the electron supply layer 5, no or little oxygen in theatmosphere enters the electron transit layer 4. Thus, the electronsupply layer 5 exposed from the opening 17 and located on the electrontransit layer 4 is entirely oxidized to form the oxide 18. On the otherhand, the surface portion of the electron transit layer 4 is notoxidized. Therefore, in the electron transit layer 4, a portioncontacting the oxide 18 and a portion contacting the electron supplylayer 5 are formed to be flush with each other.

Next, as shown in FIG. 8D, the oxide 18 is removed by etching. Theetching of the oxide 18 may be wet etching. In this case, the oxide 18may be removed by a solution, e.g., SPM (Sulfuric acid hydrogen PeroxideMixture) which is a mixture of sulfuric acid and hydrogen peroxide, bywhich the electron transit layer 4 is not removed. The oxide 18including AlON or Al₂O₃ has etching selectivity to the electron transitlayer 4 including GaN. Therefore, it is possible to etch only the oxide18 while avoiding the etching of the electron transit layer 4. Thus, thetrench 11 to expose the surface of the electron transit layer 4 isformed. In addition, in the electron transit layer 4, a portion formingthe bottom of the trench 11 and a portion other than the bottom of thetrench 11 are formed to be flush with each other.

Next, as shown in FIG. 8E, a predetermined insulating material isdeposited by, e.g., a CVD method or the like to form the gate insulatingfilm 10. Thereafter, the gate electrode 12, the source electrode 13 andthe drain electrode 14 are formed. Thus, the nitride semiconductordevice 1 is formed. As described above, according to the method of thisembodiment, the electron supply layer 5 is selectively oxidized by theplasma oxidation method to thereby form the oxide 18 in a portion of theelectron supply layer 5. According to the plasma oxidation method, whenthe oxide 18 is formed in the portion of the electron supply layer 5,since no or little oxygen in the atmosphere enters the electron transitlayer 4, it is possible to form the oxide 18 in the electron supplylayer 5 while avoiding oxidation of the electron transit layer 4. Thus,it is possible to form the electron transit layer 4 in which a portioncontacting the oxide 18 and a portion contacting the electron supplylayer 5 are flush with each other while effectively preventing theelectron transit layer 4 from being damaged.

Moreover, the oxide 18 formed in the electron supply layer 5 has theetching selectivity to the electron transit layer 4. Therefore, it ispossible to remove the oxide 18 while preventing the electron transitlayer 4 from being etched. Thus, as shown in FIG. 7, it is possible toform the electron transit layer 4 in which a portion contacting the gateinsulating film 10 and a portion contacting the electron transit layer 4are flush with each other. As a result, it is possible to provide anitride semiconductor device 1 capable of realizing a good normally-offoperation, and a method for manufacturing the same.

Second Embodiment

FIG. 9 is a sectional view showing a nitride semiconductor device 21according to a second embodiment of the present disclosure. In FIG. 9,the same elements as FIG. 6 and so on are denoted by the same referencenumerals and explanation of which will not be repeated.

In the nitride semiconductor device 21, the gate insulating film 10 isformed by using the above-described oxide 18 of the electron supplylayer 5 (see FIG. 8C). That is, the gate insulating film 10 includes theoxide 18 of the electron supply layer 5 and is formed to be integratedwith the electron supply layer 5. A thickness of the gate insulatingfilm 10 is substantially equal to a thickness of the electron supplylayer 5. On the other hand, the trench 11 is formed by using theabove-described opening 17 (see FIG. 8C) while penetrating through thespacer layer 7 and the passivation film 6 so as to expose the gateinsulating film 10, that is, the oxide 18 of the electron supply layer5. In the trench 11, the gate electrode 12 faces the electron transitlayer 4 with the gate insulation film 10 interposed therebetween.

Such a nitride semiconductor device 21 can be manufactured by performinga step of forming the gate electrode 12, the source electrode 13 and thedrain electrode 14 after the above-described step of FIG. 8C. Asdescribed above, according to this embodiment, the oxide 18 of theelectron supply layer 5 can be, as it is, used as a portion of the gateinsulating film 10. Thus, since it is possible to form the electrontransit layer 4 in which a portion contacting the gate insulating film10 and a portion contacting the electron transit layer 4 are flush witheach other, it is possible to provide a nitride semiconductor device 21capable of realizing a good normally-off operation, and a method formanufacturing the same.

Third Embodiment

FIG. 10 is a sectional view showing a nitride semiconductor device 22according to a third embodiment of the present disclosure. In FIG. 10,the same elements as FIG. 6 and so on are denoted by the same referencenumerals and explanation of which will not be repeated.

In the nitride semiconductor device 22, the gate insulating film 10 hasa stacked structure including a lower layer portion 23 formed on theelectron transit layer 4 so as to contact the electron transit layer 4and an upper layer portion 24 formed on the lower layer portion 23. Thelower layer portion 23 of the gate insulating film 10 includes theabove-described oxide 18 of the electron supply layer 5 and is formed tobe integrated with the electron supply layer 5. The upper layer portion24 of the gate insulating film 10 is formed on the lower layer portion23 along the inner wall of the trench 11. The upper layer portion 24 ofthe gate insulating film 10 may be made of one or more insulatingmaterials selected from a group consisting of SiO₂, Al₂O₃, AlON and SiN.

Such a nitride semiconductor device 22 can be manufactured by adding astep of depositing an insulating material for the upper layer portion 24of the gate insulating film 10 on the oxide 18 of the electron supplylayer 5 by means of, e.g., a CVD method, before the step of forming thegate electrode 12 after the above-described step of FIG. 8C. Asdescribed above, according to this embodiment, since it is possible toform the electron transit layer 4 in which a portion contacting the gateinsulating film 10 and a portion contacting the electron transit layer 4are flush with each other, it is possible to provide a nitridesemiconductor device 22 capable of realizing a good normally-offoperation, and a method for manufacturing the same. In addition, sinceit is possible to form a thick gate insulating film 10 including theoxide 18 of the electron supply layer 5, it is possible to increase abreakdown voltage (e.g., a breakdown resistance of the gate insulatingfilm 10) of the nitride semiconductor device 22.

Fourth Embodiment

FIG. 11 is a sectional view showing a nitride semiconductor device 31according to a fourth embodiment of the present disclosure. In FIG. 11,the same elements as FIG. 6 and so on are denoted by the same referencenumerals and explanation of which will not be repeated.

The nitride semiconductor device 31 includes a first electron supplylayer 32 formed on the electron transit layer 4 and a second electronsupply layer 33 formed on the first electron supply layer 32. Theabove-described passivation film 6 and spacer layer 7 are stacked on thesecond electron supply layer 33. The first electron supply layer 32includes a nitride semiconductor having a lattice constant smaller thanthat of the electron transit layer 4 and is formed to be coherent to theelectron transit layer 4. The first electron supply layer 32 is made ofAl_(a)Ga_(b)In_(c)N (0≤a≤1, 0≤b≤1, 0≤c≤1 and a+b+c=1). In thisembodiment, the first electron supply layer 32 is made of Al_(a)Ga_(b)N(0<a≤0.5, 0.5≤b<1.0 and a+b=1). The first electron supply layer 32 mayhave a stacked structure including a plurality of stacked nitridesemiconductor layers made of Al_(a)Ga_(b)In_(c)N (0≤a≤1, 0≤b≤1, 0≤c≤1and a+b+c=1). For example, the first electron supply layer 32 may have astacked structure where a GaN layer is stacked on an AlGaN layer. Athickness of the first electron supply layer 32 is, e.g., between 10 Åand 1000 Å.

The second electron supply layer 33 includes a nitride semiconductorhaving a lattice constant smaller than that of the first electron supplylayer 32 and is formed to be coherent to the first electron supply layer32. The second electron supply layer 33 is made of Al_(y)In_(1-y)N(0<y≤1). In this embodiment, the second electron supply layer 33 is madeof AlN. A thickness of the second electron supply layer 33 is smallerthan that of the first electron supply layer 32. For example, thicknessof the second electron supply layer 33 is between 1 Å and 100 Å. Thegate insulating film 10 is buried in the second electron supply layer 33so as to face the first electron supply layer 32.

Specifically, in this embodiment, the gate insulating film 10 contactingthe first electron supply layer 32 through the second electron supplylayer 33 is formed on the first electron supply layer 32. Morespecifically, a trench 34 penetrating through the spacer layer 7, thepassivation film 6 and the second electron supply layer 33 is formed toexpose the first electron supply layer 32, and the gate insulating film10 is formed in the trench 34. The gate electrode 12 is buried in thetrench 34 through the gate insulating film 10. The gate electrode 12 isburied in a concave space defined by the gate insulating film 10 andfaces the electron transit layer 4 with the gate insulating film 10 andthe first electron supply layer 32 interposed therebetween.

In this embodiment, the first electron supply layer 32, a portioncontacting the gate insulating film 10 and a portion contacting thesecond electron supply layer 33 are flat with each other, and morespecifically, form one flush surface located in the same plane. In otherwords, in the first electron supply layer 32, a portion forming thebottom of the trench 34 and a portion other than the bottom of thetrench 34 are flat with each other and form one surface. Further, aboundary between a portion of the first electron supply layer 32contacting the gate insulating film 10 and a portion contacting thesecond electron supply layer 33 is formed to be flush with each otherwithout a level difference in a surface portion of the first electronsupply layer 32.

In addition, an insulating film made of an oxide of the first electronsupply layer 32 is not formed in a portion of the first electron supplylayer 32 contacting the gate insulating film 10. That is, a nitridesemiconductor layer (AlGaN in this embodiment) of the first electronsupply layer 32 is exposed from the bottom of the trench 34. Then, thenitride semiconductor layer faces the gate electrode 12 with the gateinsulating film 10 contacting the first electron supply layer 32interposed therebetween.

In this embodiment, as the second electron supply layer 33 is partiallyremoved, a conduction band energy level E_(C) at an interface betweenthe first electron supply layer 32 immediately under the gate electrode12 and the electron transit layer 4 is adjusted. More specifically, theconduction band energy level E_(C) at the interface between the firstelectron supply layer 32 immediately under the gate electrode 12 and theelectron transit layer 4 is larger than a Fermi energy level E_(F)(i.e., E_(C)>E_(F)). Further, a conduction band energy level E_(C) at aninterface between the first electron supply layer 32, which does not lieimmediately under the gate electrode 12, and the electron transit layer4 is smaller than the Fermi energy level E_(F) (i.e., E_(C)<E_(F)).

When the gate electrode 12 is turned on, the conduction band energylevel E_(C) at the interface between the first electron supply layer 32immediately under the gate electrode 12 and the electron transit layer 4becomes smaller than the Fermi energy level E_(F) (i.e., E_(C)<E_(F)).Thus, 2DEG is formed immediately under the gate electrode 12, therebyflowing a current between the source electrode 13 and the drainelectrode 14. On the other hand, when the gate electrode 12 is turnedoff, the conduction band energy level E_(C) at the interface between thefirst electron supply layer 32 immediately under the gate electrode 12and the electron transit layer 4 becomes larger than the Fermi energylevel E_(F) (i.e., E_(C)>E_(F)). Thus, 2DEG is not formed immediatelyunder the gate electrode 12, thereby preventing a current from beingbetween the source electrode 13 and the drain electrode 14. In thisembodiment, a normally-off operation is realized in this manner.

FIGS. 12A to 12F are sectional views showing steps in a process ofmanufacturing the nitride semiconductor device 31 shown in FIG. 11. Asshown in FIG. 12A, in order to manufacture the nitride semiconductordevice 31, first, the substrate 2 is prepared. Next, the buffer layer 3and the electron transit layer 4 are coherently grown on the substrate 2in the order as they are written by, e.g., a CVD method or the like.

Next, as shown in FIG. 12B, the first electron supply layer 32 (AlGaN inthis embodiment) and the second electron supply layer 33 (AlN in thisembodiment) are coherently grown in the order as they are written by,e.g., a CVD method or the like. At this time, the first electron supplylayer 32 is formed on the electron transit layer 4 such that theconduction band energy level E_(C) at the interface between the firstelectron supply layer 32 and the electron transit layer 4 becomes largerthan the Fermi energy level E_(F). Then, the second electron supplylayer 33 is formed on the first electron supply layer 32 such that theconduction band energy level E_(C) at the interface between the firstelectron supply layer 32 and the electron transit layer 4 becomessmaller than the Fermi energy level E_(F).

Next, as shown in FIG. 12C, the passivation film 6 and the spacer layer7 are formed on the second electron supply layer 33 in turn by, e.g., aCVD method or the like. Next, a mask 36 having an opening 35 selectivelyin a region in which the trench 34 is to be formed is formed on thespacer layer 7. Next, an unnecessary portion of the spacer layer 7 andthe passivation film 6 is partially removed by dry etching (e.g.,reactive ion etching) using the mask 36 as a mask. Thus, as a portion ofthe trench 34, an opening 37 is formed. A portion of the second electronsupply layer 33 is exposed in the bottom of the opening 37. Thereafter,the mask 36 is removed.

Next, as shown in FIG. 12D, under the same conditions as FIG. 8C, thesecond electron supply layer 33 is selectively oxidized by a plasmaoxidation method, thereby forming an oxide 38 of the second electronsupply layer 33 in a portion of the second electron supply layer 33. Theoxide 38 includes AlON or Al₂O₃. In the portion of the second electronsupply layer 33 where the oxide 38 is formed, a distortion disappearsand a spontaneous polarization is annihilated. Therefore, the conductionband energy level E_(C) at the interface between the first electronsupply layer 32 immediately under the oxide 38 and the electron transitlayer 4 becomes smaller than the Fermi energy level E_(F).

In addition, according to the plasma oxidation method, when the oxide 38is formed in the second electron supply layer 33, no or little oxygen inthe atmosphere enters the first electron supply layer 32. Thus, thesecond electron supply layer 33 exposed from the opening 37 and locatedon the first electron supply layer 32 is entirely oxidized to form theoxide 38. On the other hand, the surface portion of the first electronsupply layer 32 is not oxidized. Therefore, the first electron supplylayer 32 is formed such that a portion contacting the oxide 38 and aportion contacting the second electron supply layer 33 are formed to beflush with each other. In addition, the electron transit layer 4 isneither oxidized nor exposed to the outside.

Next, as shown in FIG. 12E, under the same conditions as FIG. 8D, theoxide 38 is removed by etching. The oxide 38 including AlON or Al₂O₃ hasetching selectivity to the first electron supply layer 32 includingAlGaN. Therefore, it is possible to etch only the oxide 38 whileavoiding the etching of the first electron supply layer 32. Thus, thetrench 34 to expose the surface of the first electron supply layer 32 isformed. In addition, in the first electron supply layer 32, a portionforming the bottom of the trench 34 and a portion other than the bottomof the trench 34 are formed to be flush with each other.

Next, as shown in FIG. 12F, an insulating material is deposited by,e.g., a CVD method or the like to form the gate insulating film 10.Thereafter, the gate electrode 12, the source electrode 13 and the drainelectrode 14 are formed. Thus, the nitride semiconductor device 31 isformed. As described above, according to this embodiment, since theelectron transit layer 4 is not exposed to the air after the firstelectron supply layer 32 is formed, it is possible to effectivelyprevent the electron transit layer 4 from being damaged due to oxidationor etching. That is, since the electron transit layer 4 is not exposedto the air, 2DEG is not damaged due to oxidation or etching. Thus, it ispossible to provide a nitride semiconductor device 31 capable ofrealizing a stable normally-off operation, and a method formanufacturing the same.

In addition, the oxide 38 formed in the second electron supply layer 33has the etching selectivity to the first electron supply layer 32.Therefore, it is possible to remove the oxide while preventing the firstelectron supply layer 32 from being etched. Thus, since it is possibleto prevent the thickness of the first electron supply layer 32 frombeing varied due to etching or the like, it is possible to form thefirst electron supply layer 32 with a thickness as designed. As aresult, it is possible to effectively control a relationship between theconduction band energy level E_(C) and the Fermi energy level E_(F).

Fifth Embodiment

FIG. 13 is a sectional view showing a nitride semiconductor device 41according to a fifth embodiment of the present disclosure. In FIG. 13,the same elements as FIG. 11 and so on are denoted by the same referencenumerals and explanation of which will not be repeated.

In the nitride semiconductor device 41, the gate insulating film 10 isformed by using the above-described oxide 38 of the second electronsupply layer 33 (see FIG. 8D). That is, the gate insulating film 10includes the oxide 38 of the second electron supply layer 33 and isformed to be integrated with the second electron supply layer 33. Athickness of the gate insulating film 10 is substantially equal to athickness of the second electron supply layer 33. On the other hand, thetrench 34 is formed by using the above-described opening 37 (see FIG.8D) while penetrating through the spacer layer 7 and the passivationfilm 6 so as to expose the gate insulating film 10, that is, the oxide38 of the second electron supply layer 33. In the trench 34, the gateelectrode 12 faces the electron transit layer 4 with the gate insulationfilm 10 and the first electron supply layer 32 interposed therebetween.

Such a nitride semiconductor device 41 can be manufactured by performinga step of forming the gate electrode 12, the source electrode 13 and thedrain electrode 14 after the above-described step of FIG. 12D. Asdescribed above, according to this embodiment, the oxide 38 of thesecond electron supply layer 33 can be, as it is, used as a portion ofthe gate insulating film 10. Therefore, since the electron transit layer4 is not exposed to the air after the first electron supply layer 32 isformed, it is possible to effectively prevent the electron transit layer4 from being damaged. Thus, it is possible to provide a nitridesemiconductor device 41 capable of realizing a stable normally-offoperation, and a method for manufacturing the same.

Sixth Embodiment

FIG. 14 is a sectional view showing a nitride semiconductor device 42according to a sixth embodiment of the present disclosure. In FIG. 14,the same elements as FIG. 13 and so on are denoted by the same referencenumerals and explanation of which will not be repeated.

In the nitride semiconductor device 42, the gate insulating film 10 hasa stacked structure including a lower layer portion 43 formed on thefirst electron supply layer 32 so as to contact the first electronsupply layer 32 and an upper layer portion 44 formed on the lower layerportion 43. The lower layer portion 43 of the gate insulating film 10includes the above-described oxide 38 of the second electron supplylayer 33 and is formed to be integrated with the second electron supplylayer 33. The upper layer portion 44 of the gate insulating film 10 isformed on the lower layer portion 43 along the inner wall of the trench34. The upper layer portion 44 of the gate insulating film 10 may bemade of one or more insulating materials selected from a groupconsisting of SiO₂, Al₂O₃, AlON and SiN.

Such a nitride semiconductor device 42 can be manufactured by adding astep of depositing an insulating material for the upper layer portion 44of the gate insulating film 10 on the oxide 38 of the second electronsupply layer 33 by means of, e.g., a CVD method, before the step offorming the gate electrode 12 after the above-described step of FIG.12D. As described above, according to this embodiment, the oxide 38 ofthe second electron supply layer 33 can be, as it is, used as a portionof the gate insulating film 10. Therefore, since the electron transitlayer 4 is not exposed to the air after the first electron supply layer32 is formed, it is possible to effectively prevent the electron transitlayer 4 from being damaged. Thus, it is possible to provide a nitridesemiconductor device 42 capable of realizing a stable normally-offoperation, and a method for manufacturing the same. In addition, sinceit is possible to form a thick gate insulating film 10 including theoxide 38 of the second electron supply layer 33, it is possible toincrease a breakdown voltage (e.g., a breakdown resistance of the gateinsulating film 10) of the nitride semiconductor device 42.

Although a plurality of embodiments of the present disclosure has beendescribed in the above, the present disclosure may be practiced indifferent forms. For example, although it has been illustrated in theabove embodiments that the gate insulating film 10 is formed in aportion in the trench 11 and 34, the gate insulating film 10 may beformed such that the trench 11 and 34 is filled with the gate insulatingfilm 10.

In this case, in the above first to third embodiments, as shown in FIG.15, the gate electrode 12 is formed on the gate insulating film 10 withwhich the trench 11 is fully filled. The gate electrode 12 faces theelectron transit layer 4 with the gate insulating film 10 interposedtherebetween. Of course, the gate insulating film 10 may include theoxide 18 of the electron supply layer 5. In the above fourth to sixthembodiments, as shown in FIG. 16, the gate electrode 12 is formed on thegate insulating film 10 with which the trench 34 is fully filled. Thegate electrode 12 faces the electron transit layer 4 with the gateinsulating film 10 and the first electron supply layer 32 interposedtherebetween. Of course, the gate insulating film 10 may include theoxide 38 of the second electron supply layer 33.

In addition, it has been illustrated in the above fourth embodiment thatthe oxide 38 of the second electron supply layer 33 is formed andremoved to expose the first electron supply layer 32 (also see the stepof FIG. 12D). However, it is not necessary to remove the oxide 38 of thesecond electron supply layer 33 to expose the first electron supplylayer 32. That is, in the step of FIG. 12D, a portion of the secondelectron supply layer 33 may be left without being the oxide 38 as longas the conduction band energy level E_(C) at the interface between thefirst electron supply layer 32 immediately under the oxide 38 and theelectron transit layer 4 can become smaller than the Fermi energy levelE_(F). Therefore, in the configuration shown in FIG. 11, immediatelyunder the gate electrode 12, a nitride semiconductor material formingthe second electron supply layer 33 between the oxide 38 and the firstelectron supply layer 32 may be left as long as a relationship of theconduction band energy level E_(C)>the Fermi energy level E_(F) can besatisfied.

In addition, although it has been illustrated in the first embodimentthat the passivation film 6 is formed on the electron supply layer 5,this configuration may be modified as shown in FIG. 17. FIG. 17 is asectional view showing a modification of the nitride semiconductordevice 1 shown in FIG. 6. In FIG. 17, the same elements as FIG. 6 aredenoted by the same reference numerals and explanation of which will notbe repeated. As shown in FIG. 17, the nitride semiconductor device 1according to this modification further includes a cap layer 19interposed between the electron supply layer 5 and the passivation film6. The cap layer 19 is made of GaN and is formed to be coherent to theelectron supply layer 5. A thickness of the cap layer 19 is, e.g.,between 2 μm and 3 μm. A surface of the cap layer 19 in the oppositeside to the substrate 2 is formed to be flat. The cap layer 19 with theflat surface can help to increase the electron mobility in the electronsupply layer 5, which can result in a high switching response speed.

In addition, in this embodiment, the trench 11 penetrates through thecap layer 19 in addition to the spacer layer 7, the passivation film 6and the electron supply layer 5. In addition, the source electrode 13and the drain electrode 14 are both formed in ohmic contact with theelectron supply layer 5 through the cap layer 19 in addition to the gateinsulating film 10, the spacer layer 7 and the passivation film 6. Ifthe source electrode 13 and the drain electrode 14 are formed bydiffusion of Al, Al of the source electrode 13 and the drain electrode14 may be diffused into the electron supply layer 5.

The configuration of interposition of the cap layer 19 between theelectron supply layer 5 and the passivation film 6 may be applied to thenitride semiconductor device 21 (see FIG. 9) according to the abovesecond embodiment and the nitride semiconductor device 22 (see FIG. 10)according to the above third embodiment. In addition, although it hasbeen illustrated in the fourth embodiment that the passivation film 6 isformed on the second electron supply layer 33, this configuration may bemodified as shown in FIG. 18. FIG. 18 is a sectional view showing amodification of the nitride semiconductor device 31 shown in FIG. 11. InFIG. 18, the same elements as FIG. 11 are denoted by the same referencenumerals and explanation of which will not be repeated.

As shown in FIG. 18, the nitride semiconductor device 31 according tothis modification further includes a cap layer 20 interposed between thesecond electron supply layer 33 and the passivation film 6. The caplayer 20 is made of GaN and is formed to be coherent to the secondelectron supply layer 33. A thickness of the cap layer 20 is, e.g.,equal to or more than 2 μm and equal to or less than 3 μm. A surface ofthe cap layer 20 in the opposite side to the substrate 2 is formed to beflat. The cap layer 20 with the flat surface can help to increase theelectron mobility in the first and second electron supply layers 32 and33, which can result in a high switching response speed.

In addition, in this modification, the trench 34 penetrates through thecap layer 20 in addition to the spacer layer 7, the passivation film 6and the second electron supply layer 33. In addition, the sourceelectrode 13 and the drain electrode 14 are both formed in ohmic contactwith the second electron supply layer 33 through the cap layer 20 inaddition to the gate insulating film 10, the spacer layer 7 and thepassivation film 6. If the source electrode 13 and the drain electrode14 are formed by diffusion of Al, Al of the source electrode 13 and thedrain electrode 14 may be diffused into the second electron supply layer33.

The configuration of interposition of the cap layer 20 between thesecond electron supply layer 33 and the passivation film 6 may beapplied to the nitride semiconductor device 41 (see FIG. 13) accordingto the above fifth embodiment and the nitride semiconductor device 42(see FIG. 14) according to the above sixth embodiment. In addition,although it has been illustrated in the first to sixth embodiments thatthe spacer layer is formed, the spacer layer may not be formed.

Others, a variety of changes in design may be made within the scope ofthe present disclosure defined in the appended claims.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the disclosures. Indeed, the novel methods and apparatusesdescribed herein may be embodied in a variety of other forms;furthermore, various omissions, substitutions and changes in the form ofthe embodiments described herein may be made without departing from thespirit of the disclosures. The accompanying claims and their equivalentsare intended to cover such forms or modifications as would fall withinthe scope and spirit of the disclosures.

What is claimed is:
 1. A nitride semiconductor device comprising: anelectron transit layer including Ga_(x)In_(1-x)N (0<x≤1); an electronsupply layer formed on the electron transit layer and includingAl_(a)Ga_(b)In_(c)N (0≤a≤1, 0≤b≤1, 0≤c≤1 and a+b+c=1); a gate insulatingfilm formed to pass through the electron supply layer to contact theelectron transit layer; and a gate electrode facing the electron transitlayer with the gate insulating film interposed therebetween, wherein thegate insulating film includes an oxide of the electron supply layer. 2.The nitride semiconductor device of claim 1, further comprising a trenchformed in the electron supply layer to expose the electron transitlayer, wherein the gate insulating film is formed in the trench.
 3. Thenitride semiconductor device of claim 2, further comprising anonconductive spacer layer formed on the electron supply layer, whereinthe trench is formed to expose the electron transit layer through thespacer layer and the electron supply layer.
 4. The nitride semiconductordevice of claim 3, wherein the gate insulating film is formed along aninner wall of the trench and a surface of the electron transit layer,and wherein, in the gate insulating film, a portion formed along theinner wall of the trench is thicker than a portion formed along thesurface of the electron transit layer.
 5. The nitride semiconductordevice of claim 1, wherein the gate insulating film includes AlON. 6.The nitride semiconductor device of claim 1, wherein the gate insulatingfilm is formed to have a thickness so that an electric field in the gateinsulating film is equal to or less than 10 MV/cm.
 7. The nitridesemiconductor device of claim 1, wherein, in the electron transit layer,a portion contacting the gate insulating film and a portion contactingthe electron transit layer are flush with each other.
 8. The nitridesemiconductor device of claim 7, further comprising a trench formed inthe electron supply layer to expose the electron transit layer, whereinthe gate insulating film is formed in the trench.
 9. The nitridesemiconductor device of claim 8, further comprising a nonconductivespacer layer formed on the electron supply layer, wherein the trench isformed to expose the electron transit layer through the spacer layer andthe electron supply layer.
 10. The nitride semiconductor device of claim9, wherein the gate insulating film is formed along an inner wall of thetrench and a surface of the electron transit layer, and wherein, in thegate insulating film, a portion formed along the inner wall of thetrench is thicker than a portion formed along the surface of theelectron transit layer.
 11. The nitride semiconductor device of claim 7,wherein the gate insulating film includes AlON.
 12. The nitridesemiconductor device of claim 7, wherein the gate insulating film isformed to have a thickness so that an electric field in the gateinsulating film is equal to or less than 10 MV/cm.
 13. A nitridesemiconductor device comprising: an electron transit layer includingGa_(x)In_(1-x)N (0<x≤1); an electron supply layer formed on the electrontransit layer and including Al_(a)Ga_(b)In_(c)N (0≤a≤1, 0≤b≤1, 0≤c≤1 anda+b+c=1); a gate insulating film formed to pass through the electronsupply layer to contact the electron transit layer; a gate electrodefacing the electron transit layer with the gate insulating filminterposed therebetween; a trench formed in the electron supply layer toexpose the electron transit layer; and a nonconductive spacer layerformed on the electron supply layer, wherein the gate insulating film isformed in the trench, wherein the trench is formed to expose theelectron transit layer through the spacer layer and the electron supplylayer, wherein the gate insulating film is formed along an inner wall ofthe trench and a surface of the electron transit layer, and wherein, inthe gate insulating film, a portion formed along the inner wall of thetrench is thicker than a portion formed along the surface of theelectron transit layer.
 14. The nitride semiconductor device of claim13, wherein, in the electron transit layer, a portion contacting thegate insulating film and a portion contacting the electron transit layerare flush with each other.
 15. A nitride semiconductor devicecomprising: an electron transit layer including Ga_(x)In_(1-x)N (0<x≤1);an electron supply layer formed on the electron transit layer andincluding Al_(y)In_(1-y)N (0<y≤1), without including Ga; a gateinsulating film formed to pass through the electron supply layer tocontact the electron transit layer; a gate electrode facing the electrontransit layer with the gate insulating film interposed therebetween; atrench formed in the electron supply layer to expose the electrontransit layer; and a nonconductive spacer layer formed on the electronsupply layer, wherein the gate insulating film includes one or moreinsulating materials selected from a group consisting of SiO₂, Al₂O₃,AlON and SiN, wherein the gate insulating film is formed in the trench,wherein the trench is formed to expose the electron transit layerthrough the spacer layer and the electron supply layer, wherein the gateinsulating film is formed along an inner wall of the trench and asurface of the electron transit layer, and wherein, in the gateinsulating film, a portion formed along the inner wall of the trench isthicker than a portion formed along the surface of the electron transitlayer.
 16. The nitride semiconductor device of claim 15, wherein thegate insulating film includes AlON.